Hychem XE40 Hardener — Rapid curing epoxy hardener

When used with SupaFloor:

When used with GP Resin:

NOTE: Refer to the respective SupaFloor and GP technical data sheets for further information including surface preparation, environmental conditions, chemical resistance and colour.

• Minimum substrate temperature 10°C
• Maximum substrate temperarure 25°C
• Substrate temperature must be 5°C above dew point
• Substrate moisture less than 5%

XE40 Hardener may not necessarily give the same gloss levels as the conventional SupaFloor hardener so it’s suitability is more for base coats rather that topcoats.

However, the level of finish acheived for a topcoat with XE40 Hardener may certainly be satisfactory depending on the application and also the environment under which it is applied.

If under any doubt please call Hychem for advice.

10 litre pail 20 litre pail 190 kg drum

12 months from date of manufacture, stored under shelter at 25ºC in the original un-opened container.

Field support where provided, does not constitute supervisory responsibility.

Suggestions made by HYCHEM either verbally or in writing may be followed, modified or rejected by the owner, engineer or contractor since they and not HYCHEM are responsible for carrying out procedures appropriate to a specific application.

The technical information and application advice given in this publication is based on the best information available at the time of print. As the information herein is of a general nature, no assumption can be made as to the product suitability for a particular use or application and no warranty as to its accuracy, reliability or completeness either expressed or implied is given other than those required by Commonwealth or State Legislation. The owner, his representative or the contractor is responsible for checking the suitability of products for their intended use.

Hychem XE40 Hardener is a rapid curing epoxy hardener designed to be used with the epoxy resin component for SupaFloor and GP. Using XE40 Hardener will reduce the cure time of these resins to approximately half the conventional system.